3D BGA Reballing Stencil Plant Tin Steel Net Repair Stencil For IPhone IC Chip A11

The new 3D implant template features a grooved design that allows the template to be quickly aligned with the tinned position of the IC.The square hole design makes it easier to remove the formed solder balls. Whether you are a beginner or an expert, this 3D template is easy to use.

Features:
3D infrared forming, high quality imported steel, thickened and hardened. It is heated evenly and is not easily deformed when heated, and has a long service life.
The unique groove step type alignment, the position is clearly visible, and the automatic alignment enables quick positioning of the IC that needs to be tinned.
The success rate of planting tin is high, and a solder ball can be formed once skilled.
Indented 1mm positioning groove, small IC can also be quickly positioned, equipped with a dedicated IC slot.
Single-use, no mold, accurate, fast and simple.

Specification:
Size: 6.9 * 8.5 * 0.25cm / 2.7 * .3.3 * 0.1in
Weight: 11.8 g
Material: Steel
A8 series for iPhone 6, 6 plus
A11 series for iPhone8, iPhone 8 plus, iPhone x

Package list:
1 * 3D Plant Tin Network

Note:
The measurement allowed error is +/- 1-3cm.