WEICON Epoxy Minute Adhesive is versatile, bonding a variety of materials including metal, plastic, fiber-reinforced materials, ceramics, glass, stone, and wood. This adhesive is ideal for construction and assembly tasks where the WEICON Easy-Mix System is not practical.

- Base: Epoxy resin, non-filled- Filler: Unfilled- Texture: Viscous Processing:- Temperature: +10°C to +30°C- Curing Temperature: +6°C to +40°C- Mixing Ratio (by weight): 1:1- Viscosity at +20°C: 8,500 m Pa·s- Density: 1.15 g/cm³- Gap Bridging: Up to 2 mm max Curing:- Pot Life at 20°C (10 ml batch): 3-4 min- Handling Strength (35% strength): 30 min- Working Strength (50% strength): 1 hour- Final Strength (100% strength): 24 hours- Shrinkage: 2.0%Mechanical Properties (After Curing):- Tensile Strength (DIN EN ISO 527-2): 40 MPa- E-Modulus (Tensile, DIN EN ISO 527-2): 2,000 - 2,500 MPa- Compressive Strength (DIN EN ISO 604): 9 MPa- Bending Strength (DIN EN ISO 178): 58 MPa- Hardness (Shore D, DIN ISO 7619): 65Lap Shear Strength (Material Thickness 1.5mm, DIN EN 1465):- Steel (1.0338 Sandblasted): 20 N/mm²- Aluminium (Sandblasted): 19 N/mm²- PVC-Rigid (Roughened): 13 N/mm²Thermal Parameters:- Temperature Resistance: -50°C to +80°CElectrical Parameters:- Dielectric Strength (DIN EN 60243-1 at 20°C): 20 kV/mm