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Highlights

Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
Good toughness
High temperature resistance
0.12mm, make phone repairs easier, make reballing work easier.
Heated anti-drum design

Key Attributes

SKU ID	SPT0139
Dimensions (Length x Width x Height)	10cm x 5cm x 2cm
weight	0.05kg
Stock Location	China
Country of Origin	China
Brand	SUNSKY

Shipment Information

Weight per item	0.05 kg
Dimensions per item (LWH)	10 x 5 x 2 cm
Carton weight	0.05 kg
Carton dimensions (LWH)	19 x 10 x 1 cm
Pieces per carton	3
Stock location	China

SUNSKY

iPhone 11 BGA Reballing Stencil - 0.12mm Mijing SUNSKY for 11 Pro/Max

Name: iPhone 11 BGA Reballing Stencil - 0.12mm Mijing SUNSKY for 11 Pro/Max
Brand: sunsky
SKU: SPT0139
Price: 12.04 AED
Availability: InStock

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AED 15.66

AED12.04

-23%

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Extra 27% off

AED 11.44

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Extra 31% off

AED 10.84

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Overview

iPhone 11 BGA Reballing Stencil - 0.12mm Mijing SUNSKY for 11 Pro/Max