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Brand:
genericCPU Processor Thermal Conductive Paste Grease PC Heat-sink Cooling Cream
About this item
Specific Gravity: > 2.5; Thixotropic Index: 380 +/-10
Thermal Conductivity: > 3.8 W/m*K
Thermal Impedance: < 0.087 degC- in²/W
The compound will be delivered in a Syringe and can be easily used for dispensing the Paste in thin layers between Processor and Heat Sink and normally is sufficient for 3 - 10 uses.
It is 1g Gold thermal compound which has with 3.8W/mK a very high thermal conductivity and is therefore good for nearly all cooling applications.
Unit size:
1 piece
Number of packs in one carton:
1
Min. Order Quantity:
1 piece
Stock location:
China
Estimated Lead Time (business days)
10 Days
International delivery:
Available shipping options, costs and estimated shipping times will be shown during checkout.
Carton dimensions (LWH):
15 cm x 1 cm x 1 cm
Carton weight:
14 g
Quantity (piece)
Minimum order quantity is 1 piece
Min. Order Quantity:1 piece
Shipping & Returns
Overview
Product description
It is 1g Gold thermal compound which has with 3.8W/mK a very high thermal conductivity and is therefore good for nearly all cooling applications.
The compound will be delivered in a Syringe and can be easily used for dispensing the Paste in thin layers between Processor and Heat Sink and normally is sufficient for 3 - 10 uses.
Specification:
Thermal Conductivity: > 3.8 W/m*K
Thermal Impedance: < 0.087 degC- in²/W
Specific Gravity: > 2.5
Thixotropic Index: 380 +/-10
Working Temperature: -50 -340degC
Type:Thermal Grease
Package List:
1 x Thermal Conductive Grease